JAKARTA -PT Tiphone Mobile Indonesia Tbk (TELE), a retail trade company, recorded its total bond of Rp 650 billion until this year. One of debt has issued in 2016 will mature on October 14, 2019.
Based on the company's prospectus, the company issued the Shelf Registration I Tiphone I phase II 2016 Series B worth Rp 256 billion with the interest rate of 9.50% for period three years. The bond listed in the capital market on March 31, 2019, and will mature on October 14, 2019. To repay the debt, the company will issue the Shelf Registration II phase II 2019 worth Rp 500 billion. And, the remaining fund will be used to inject the subsidiaries working capital. (LK)
In the same year, the company also issued the Shelf Registration I Tiphone Phase II 2016 series C worth Rp 110 billion for five years period with an interest rate of 10.65% per year. The Bond listed in the Indonesia Stock Exchange on March 31, 2016. In 2017, Tiphone issuance the Self Registration I Phase III Series B worth Rp 231 billion with an interest rate of 10.50% per annum for three years. The Bond listed in the IDX on July 31, 2017.
While, in 2018, the company issued the Shelf Registration II phase II worth Rp 53 billion. The bond interest rate of 11.50% per year for a period of three years. The bond listed on the IDX on February 7, 2019, and will mature on February 18, 2020. (LK)