TBIG - PT. Tower Bersama Infrastructure Tbk

Rp 1.275

+30 (+2,41%)

JAKARTA - PT Tower Bersama Infrastructure Tbk (TBIG) will issue Shelf Registered Bonds phase IV/2020 with a total value of Rp 1.5 trillion. These bonds will be issued in two series, Series A (Rp 633 billion) and B (Rp 867 billion). 

As quoted from the company's disclosure published on Friday (6/3), the series A bonds will be offered with a fixed interest rate of 6.25% per annum and a 370 days tenor, while for the series B bonds will be offered with an interest rate of 7.75% per annum and a three-year tenor.

Funds obtained from the issuance of the bonds will be used to pay part of the debt of PT Solu Sindo Kreasi Pratama (SKP), a subsidiary of TBIG, to United Overseas Bank Ltd.

The company has received an 'AA-' (idn) rating from PT Fitch Ratings Indonesia. The underwriters are PT CIMB Niaga Sekuritas, PT DBS Vickers Sekuritas Indonesia, and PT Indo Premier Sekuritas, while the trustee is PT Bank Rakyat Indonesia (Persero) Tbk (BBRI). (LK/AR)