JAKARTA. PT Tiphone Mobile Indonesia Tbk (TELE) is trying to raise Rp 150 billion by issuing Shelf Registration Bonds II phase III/2020, with a fixed interest rate of 11.5% and a 3-year tenor.
TELE's management explained that the proceeds from the issuance of the bonds will be used to pay its Rp 20 billion debt to PT CIMB Niaga Tbk (CIMB). Then, Rp 40 billion will be used to pay the debts of 2 of its subsidiaries.
Meanwhile, the remaining Rp 90 billion will be given as loans to its subsidiaries, with the same interest rate as the bonds.
TELE appointed PT Bahana Sekuritas as the guarantor for the issuance of bonds. Meanwhile, PT Bank Bukopin Tbk (BBKP) was appointed as trustee.
For information, TELE still has a quota to issue Rp 150 billion worth of bonds. (KR/AR)