JAKARTA - PT Integra Indocabinet Tbk (WOOD) will issue Shelf Registration Bonds Phase I 2021 of IDR 450 billion and Sukuk Mudharabah Phase I 2021 of IDR 150 billion. The initial offering period of the Bonds and Sukuk will be carried out from tomorrow until next week (19-25/3) and the public offering will start (7-8/4).
Quoted from the brief prospectus published on Thursday (18/3), Bonds and Sukuk are offered in Series A and B, respectively, with periods of 370 days and three years. The proceeds from the issuance of these bonds will be used to pay liabilities (refinancing) and working capital.
PT Pemeringkat Efek Indonesia (Pefindo) has assigned a single A minus (idA-) rating for the bonds and Single A minus sharia (idA-)sy for the Sukuk Mudharabah. The underwriters appointed, among others, PT Trimegah Sekuritas Indonesia Tbk (TRIM) and PT BRI Danareksa Sekuritas, while the trustee is PT Bank Rakyat Indonesia (Persero) Tbk (BBRI). (LK/LM)