HomeNewsVideos

Tower Bersama Infrastructure to issue another bond equal to IDR 970 billion

24 March 2021 20:15

JAKARTA. PT Tower Bersama Infrastructure Tbk (TBIG), the telecommunication tower provider company, is issuing its Shelf-Registration Bond IV Phase IV Year 2021 with the principal value of IDR 970 billion.

This bond would be offered with a flat interest rate of 5.50% per year, while the interest’s payment would take place every three months. With its tenor of 370 calendar days, this debt security will be matured by April 19, 2022.

According to the Indonesia Central Securities Depository (KSEI) official data, the bond would be issued on April 1, 5, and 6, 2021, then would be recorded at Indonesia Stock Exchange on April 12, 2021. TBIG has appointed PT CIMB Niaga Sekuritas, PT DBS Vickers Sekuritas Indonesia, and PT Indo Premier Sekuritas as the underwriters.

This bond issuance is a part of Shelf-Registration Public Offerings of TBIG through its Shelf-Registration Bond Phase IV, which seeks the target of IDR 7 trillion. Prior to this bond issuance, the company has issued three other bonds, with principal amounts of IDR 700 billion, IDR 750 billion, and IDR 2.92 trillion each. (KR/ZH)

© 2024 - IDN Financials - All Rights Reserved.