JAKARTA. PT Integra Indocabinet Tbk (WOOD) would issue its Shelf-Registration Bonds I Phase I Year 2021 and Shelf-Registration Sukuk Mudharabah I Phase I Year 2021, amounting to IDR 600 billion.
Based on the registration information at Indonesia Central Securities Depository, the bonds to be issued would have a principal amount of IDR 450 billion. The bonds would be offered in two series with the highest annual interest of 10.25% and the most extensive tenor of three years.
Simultaneously, the shelf-registration sukuk mudharabah to be offered would have a principal amount of IDR 150 billion. The said sukuk mudharabah would be issued within two series with a floating profit sharing per year and the longest tenor of three years.
The public offering of the bonds would occur on April 12, 2021, and would be distributed electronically on April 14, 2021. The registration would then take place on April 15, 2021. Furthermore, WOOD has assigned PT Trimegah Sekuritas Indonesia Tbk (TRIM) and PT BRI Danareksa Sekuritas as the underwriters during the bonds’ issuance. (KR/ZH)