JAKARTA – PT Tower Bersama Infrastructure Tbk (TBIG) paid off the Series A of its Shelf-Registration Bonds IV Phase III Year 2021 due last week (27/2). Director of Tower Bersama Infrastructure, Helmy Yusman Santoso, relayed the news in the information disclosure quoted Wednesday (3/3).
It was mentioned that the par value of the Shelf-Registration Bonds IV 2021 amounted to IDR 1.89 trillion. There was also the additional fourth round of interest payment of IDR 28.99 billion that resulted from the annual 5.5% interest rate. TBIG received an “AA+(idn)” from PT Fitch Ratings Indonesia (Fitch) in regard to the issuance of the said bonds last year (12/11).
The bonds were offered back on November 10, 2021, with Series A worth IDR 1.89 trillion with a 370-days tenor and Series B worth IDR 1.01 trillion with an interest rate of 6.75% a three-year tenor. The assigned underwriters were PT CIMB Niagas Sekuritas, PT DBS Vickers Sekuritas Indonesia PT Indo Premier Sekuritas, and PT OCBC Sekuritas Indonesia. Then, the appointed trustee as PT Bank Rakyat Indonesia (Persero) Tbk (BBRI). (KR/ZH)