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Tower Bersama Infrastructure to issue Rp 1 trillion bond to pay off subsidiary's debt

07 October 2022 10:53

JAKARTA - PT Tower Bersama Infrastructure Tbk (TBIG) will issue Shelf-Registered Bonds V Phase V Year 2022 with a principal amount of IDR 1 trillion.

In the bond offering prospectus, the bonds will be issued with a coupon of 5.25% per annum and a term of 370 calendar days, from the issuance date. Bond interest will be paid every three months.

The bond public offering period will be held on October 17-18, 2022. The electronic bond distribution is scheduled for October 21, 2022 and listing on IDX in October 24, 2022.

Later, around IDR305.9 billion of the bond proceeds will be handed over to PT Tower Bersama (TB) to pay off its debts. Then, the remaining IDR695.8 will be given to PT Solu Sindo Kreasi Pratama (SKP) to pay part of the principal debt.

Thr implementing underwriters for this bond are PT Indo Premier Sekuritas, PT CIMB Niaga Sekuritas, PT DBS Vickers Sekuritas Indonesia, PT Trimegah Sekuritas Tbk (TRIM) and PT Aldiracita Sekuritas Indonesia. Meanwhile, PT Bank Tabungan Negara (BBTN) is appointed as the trustee.

TBIG has receivef an "AA+(idn)" rating from Fitch Ratings Indonesia for the bonds offered. (KR/LM)

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