JAKARTA - PT Tiphone Mobile Indonesia Tbk (TELE) is seeking the fresh fund worth Rp 500 billion by offering the Shelf Registration Obligation II Tiphone Phase II 2019. The Bond will be offered to the public on September 13, 2019 and will be distribute on September 16, 2019.
As cited of the company's prospectus, the Bond is offered in scripless amounting of Rp 300 billion for period three years and an interest rate of 11.50% per year. While, the remaining bond is offered of Rp 200 billion and will guarantee as best effort. The Bond interest rate payment will be paid every three months. And, the first payment Bond interest rate will be conducted on December 18, 2019.
The company will use the Bond fund amounting of Rp 256 billion to payment its debt that mature in October 14, 2019. The bond fund remaining will be used for the working capital of the subsidiaries. In the first semester of 2019, Tiphone recorded the liability at Rp 4.50 trillion. (LK)