JAKARTA. PT Tiphone Mobile Indonesia Tbk (TELE) has postponed the distribution of its Shelf Registration Bonds III phase III/2020 until further notice.
Hartati Handayani, Head of the Custodian Service Division of Indonesian Central Securities Depository Services Division (KSEI), stated that the bond distribution was originally scheduled for 23 April 2020. The postponement, said Handayani, had been decided by considering the letter received by KSEI from TELE.
As previously reported on IDNfinacials.com, TELE plans to use the proceeds from the bonds to improve its liquidity. For information, the company has a debt of Rp 20 billion to PT Bank CIMB Niaga Tbk (CIMB), and two of its subsidiaries also have debts with a total value of Rp 40 billion.
Previously, TELE had appointed Bahana Sekuritas as the guarantor of the bonds, as well as PT Bank Bukopin Tbk (BBKP) as the trustee. (KR/AR)