JAKARTA. PT Tower Bersama Infrastructure Tbk (TBIG) issued Shelf Registration Bond IV Phase I/2020 with a total value of Rp 700 billion, which will be used to pay part of the debt of its subsidiary, PT Solu Sindo Kreasi Pratama.
TBIG management offers the bonds in 2 series. Series A is offered with a total value of Rp 231 billion, a fixed interest rate of 6.3% per annum and a tenor of 370 calendar days. Meanwhile, series B is offered with a total value of Rp 469 billion, a fixed interest rate of 8% per annum, and a tenor of 3 years.
Aside from using the proceeds of the bonds, TBIG will use internal cash and other funding sources to pay off the debt of its subsidiary.
"From banks and / or financial institutions," said TBIG's management in its prospectus.
TBIG appointed PT CIMB Niaga Sekuritas, PT DBS Vickers Sekuritas Indonesia, and PT Indo Premier Sekuritas as underwriters for the issuance of bonds. PT Bank Rakyat Indonesia (Persero) Tbk (BBRI) was appointed as the trustee. (KR/AR)