JAKARTA - PT Tower Bersama Infrastruktur Tbk (TBIG) will issue its Shelf Registration Bonds IV Phase II/2020 with a principal of IDR 750 billion. These bonds will be offered at the end of the month (26-27/11).
As quoted from the company's brief prospectus published on Monday (16/11), the bonds are offered in two series; Series A with a principal of IDR 295 billion, an interest rate of 5.75% per annum, and a tenor of 370 days. Meanwhile, Series B has a principal of IDR 455 billion, an interest rate of 7.25% per annum, and a three-year tenor. These bonds are guaranteed using company assets.
The proceeds from the bonds will be used to provide revolving loan facility through its subsidiary, PT Solu Sindo Kreasi Pratama (SKP) to creditors, through United Overseas Bank Ltd as the agent.
The underwriters for the corporate action are PT CIMB Niaga Sekuritas, PT DBS Vickers Sekuritas Indonesia, and PT Indo Premier Sekuritas. Meanwhile, the appointed trustee is PT Bank Rakyat Indonesia (Persero) Tbk (BBRI). PT Fitch Ratings Indonesia gives an AA- (idn) rating for the bonds. (LK/AR)