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Bali Towerindo speeds up the payment for Bond I 2020

05 August 2021 10:09

JAKARTA – PT Bali Towerindo Sentra Tbk (BALI), a telecommunication tower managing company, accelerates the acquittance of the Shelf-Registration Bond I Phase I 2020 to August 12, 2021. The bond’s initial maturity date is June 24, 2023. This shift in schedule had been decided during the General Bondholders Meeting earlier this week (2/8).

Lily Hidayat, Corporate Secretary of Bali Towerindo, claims that the second meeting a couple of days ago was joined by legitimate bondholders that own IDR 550 billion or 99.28% of the unpaid bond value. “The debt would be fully repaid or 100% of the principal amount of Bond I Phase I 2020. The bond’s interest would also be paid by calculating it to its [new] maturity date of August 12, 2021,” Hidayat further elaborates.

The meeting also agreed to give incentives of 0.25% of the bond’s principal value to the present bondholders. The disbursement of the interest and incentives would take place next week (12/8). The trustee for this bond issuance is PT Bank KB Bukopin Tbk (BBKP). (LK/ZH)

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